Wave Solder/Hot Air Leveling Tape1 mil Electrical Grade POLYIMIDE film coated with a high performancesilicone adhesive. Total thickness: 2.6 mil (0.065mm).Thin and conformable, with outstanding tear and abrasion resistanceat elevated temperatures. Adhesive will thermoset toincrease adhesion values. Leaves minimal residue when removedafter manufacturing process; reduces clean-up time and minimizesrejects. Permits observation of board during processing.Excellent resistance to acids, oils, solvents, aging, staining, waterimmersion. Protects gold contacts from molten solder during hot airwave solder leveling process.

Adhesion: 25 oz/in. Tensile: 30 lbs/in.
Elongation: 50%. Temp. resistance: -100°F to 500°F (-73°C to288°C).
Dielectric strength: 6500V.
Color: Amber (transparent)
UL510 approved for flame retardance.
Mil spec: MIL-P-46112B

Alternative to Dielectric Polymer #NT-590; Permacel #221;Scapa #556; 3M #5413; Ideal #9321, #7170; TLC #CT961; Dewal #304-1;St. Gobain/Furon #2345-1; Specialty Tapes #S2210; Ideal #IT-7170;Lanmar #595-1; Chemfab #360-1S; Bondtec #911-22A

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